LOCAL DESIGN REVIEW English website · Content pending business approval

GUIDE / PCBELEC

FR-4 PCB Materials

Compare FR-4 laminate requirements for rigid and multilayer PCBs: grade, Tg, dielectric construction, copper and approved substitutions.

Discuss your requirements
Illustrative green bare PCB sample for the FR-4 material guide

Illustrative image from the original PCBELEC website.

What is FR-4?

FR-4 is a glass-reinforced epoxy laminate used as the insulating base of rigid printed circuit boards. Copper circuitry is formed on the laminate, while multilayer constructions combine cores and bonding layers into the required stackup. Its balance of insulation, mechanical strength and manufacturability makes it a starting point for many rigid-board projects.

FR-4 is a material category, not a complete specification

Two boards described simply as “FR-4” can use different resin systems, glass styles, resin contents and copper constructions. For a repeatable build, identify an approved laminate grade or define the properties and substitution process that the design requires. PCBELEC’s material portfolio includes standard, mid-Tg, high-Tg and halogen-free FR-4 options.

Compare the requirements behind the grade

Select a material against the complete application and assembly requirements. A single headline property cannot describe the finished board.

Compare the requirements behind the grade
RequirementWhy it belongs in the specification
Thermal behaviorReview the resin system, assembly exposure and operating environment together.
Electrical behaviorFor controlled impedance, define dielectric thickness and the relevant material data.
Mechanical constructionSpecify finished thickness, tolerance and copper distribution.
SubstitutionsState whether an equivalent grade may be proposed and who approves it.

FR-4, high-Tg or an RF laminate?

FR-4 can be appropriate for many rigid and multilayer designs. Higher thermal demands may justify a high-Tg grade; demanding RF loss and dielectric requirements may lead to a specialized laminate. These are separate design decisions. Higher Tg alone does not establish a low-loss RF specification.

Prepare a material review

Send the board stackup with the material requirement. If the laminate is undecided, identify the thermal, electrical and mechanical constraints so that proposed options can be reviewed against the same design.

  • Approved manufacturer and grade, if specified.
  • Core and dielectric thicknesses, copper requirements and finished board thickness.
  • Assembly temperature exposure and relevant end-use constraints.
  • Controlled impedance targets and the layers to which they apply.
  • Permitted alternatives and any required material records.

Questions, answered

Before your next build

Is all FR-4 the same?

No. FR-4 is a material category. Resin system, glass construction, copper and laminate grade can differ. Use the approved grade and stackup for a controlled build.

CONTINUE YOUR REVIEW

Related manufacturing resources

guide

High-Tg PCB Materials

Understand high-Tg FR-4 selection for thermally demanding PCBs, including assembly exposure, laminate properties and stackup requirements.

capabilities

PCB manufacturing capabilities

Review PCB construction, materials, copper, drilling, surface finish and verification requirements before submitting a manufacturing quotation.

YOUR NEXT PCB PROJECT

Let’s define your next build.

Start with your files, requirements and target date.

Prepare a PCB inquiry